From: "Elizabeth A. Citrin" Subject: SDO Weekly Report for July 16, 2004 SDO Weekly Report for July 16, 2004 Project monthlies this week included discussions on readiness for subsystem CDR=92s, in addition to the usual schedule and cost status. Progress toward CDR milestones has generally been good, although issues have been encountered in some areas. In the Weekly SDO Systems Meeting, the team discussion centered on the status of spacecraft Mechanical ICDs (MICD's), which were due to the Spacecraft mechanical team last month to aid them in assessing the overall Spacecraft mechanical design and accommodation of Observatory components. In addition, the Systems Engineering team generated a draft set of CDR guidelines for the upcoming Subsystem and Mission CDRs, which were forwarded to SDO project management and senior staff for review. These guidelines, once finalized, will be forwarded to the Code 300 and Independent review teams for guidance, as well as to the SDO team itself for direction as the project approaches CDR. The Systems team also provided a list of subsystem critical items for CDR to the SDO Observatory Manager for use in the monthly status meetings with SDO instruments and subsystems, identifying critical development areas that need additional focus in order to meet CDR guidelines and schedule. AIA and SDO continued efforts to complete the Phase C/D/E contract definitization by July 31; LMSAL program management traveled to GSFC to discuss the fee structure and EVM planning. Updates to the PDR thermal design will be presented at a Thermal Control System peer review to be held at LMSAL August 9th prior to the next interface working group meeting. The EDU RAD6000 processor successfully completed testing at BAE and the housekeeping/ADC brassboard goes out for fabrication this week. HMI held a successful peer review on the Focal Plane Assembly that included GSFC participants. The peer review was in response to a Mission PDR request for additional information. The first full Spacecraft Simulator (SSIM) was delivered to HMI this week by the SDO EGSE team. The delivered SSIM included a high speed science data interface. HMI is progressing towards the SUROM Pre-Burn Acceptance Test scheduled in August 2004. LM and SAO have made significant progress to bring their ICD effort back on schedule. Telescope structural development continues with verification of the telescope assembly flange bonding and additional testing of the ball joint mount. A revision was made to the telescope optical prescription to allow for an increase in the back focal length to improve the spacing between the primary mirror and the FPA mechanisms. Purchase orders for NRE at Tinsley and ATK/COI were issued. Assembly of the Gimbal Control Electonics  ASD SDN was completed this week. Assembly of the PSE ASD SDN Breadboard commenced. Fabrication of the High Gain Antenna System (HGAS) GIC Breadboard commenced. Layout continued for the C&DH Ka Comm Card, S Comm Card, BMC, and DC/DC Breadboards. A decision was made to continue with the Xilinx FPGA design for the Ka Comm Breadboard, but to stop the downlink ASIC effort and instead use a FPGA design for ETU and Flight. The MMIC life test of the Ka-Band SSPA Breadboard#2 was stopped due to degradation in output power; lessons learned from this test are being factored in to the design of the SSPA Breadboard #3. Negotiations began with a selected vendor for the HGAS Gimbal Actuator. Evaluation of the C&DH SBC proposals are still on-going. A Request for Offer (RFO) was released for the SDO Propulsion System Propellant Tank. RFI Responses were received for the ACS Reaction Wheel and Star Tracker. Presolicitation notice was released for all ACS procurements; ACS RFOs will be released after the required 15 day notification time period. Project Monthly meetings were held with all spacecraft subsystem leads and instrument managers to review schedule and budget progress. For Ka Band, SSPA Box 1 MMIC life testing (hot thermal chamber) was halted after nineteen days due to all margins having been used. Preliminary investigation findings (via X-ray) are currently pointing to potential voids in solder attachment of the MMIC. Investigation continues on the exact cause of anomaly. It should be noted that Box 1 lacked process controls. Chips, carriers, and solder pieces used were among the last available. In addition, the unit was not protected from power oscillations (protection resistors in new design were not included in Box1). The plan now is to utilize another test fixture and run another life test on new MMICs, using the better carrier and preform sizes that have been implemented for the most recent designs, and with the circuit protections in place. Liz Citrin SDO Project Manager 301-286-1222 FAX 301-286-0214 Cell 410-241-0503